The Hitachi D-9000 is part of the Conductor Etch System 9000 Series, designed to address the demanding requirements of next-generation semiconductor fabrication processes. It is tailored for manufacturing devices at 20nm and below, which require sophisticated etching techniques including double-patterning and 3D structures. The platform utilizes a proprietary low-contaminant, high-speed transfer system that significantly enhances productivity. It features a modular chamber design that allows for process flexibility and future expansion, accommodating advancements in technology such as the transition to 450-mm wafer sizes. Its microwave Electron Cyclotron Resonance (ECR) plasma etching chamber has been validated for high-volume manufacturing, ensuring reliable performance in critical manufacturing environments. The system supports 300mm wafer diameters and can configure up to 9 chambers, allowing for extensive operational scalability and versatility.
