- xMEMS Labs and Dongguan Rayking Electronics have partnered to develop a turnkey Cypress + Alta-S MEMS speaker module for next-generation TWS earbuds, combining xMEMS’ solid-state audio technology with Rayking’s manufacturing expertise.
- The Cypress MEMS speaker, featuring piezoMEMS “sound-from-ultrasound” technology, delivers groundbreaking performance with SPLs exceeding 140dB at 20Hz, enabling superior ANC and sound clarity in compact designs.
- The module simplifies earbud design, reduces time-to-market, and allows OEMs to mass-produce solid-state MEMS-based earbuds, with sampling available now and mass production expected in early 2026.
- xMEMS’ solid-state architecture offers faster mechanical response, improved noise isolation, and space-saving benefits, replacing traditional dynamic drivers and enabling advanced features like longer battery life.
- The Cypress + Alta-S module will debut at xMEMS Live Asia 2025, marking a significant milestone in the commercialization of MEMS audio for wireless earbuds.
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xMEMS and Rayking Partner for Next-Gen MEMS Speaker Integration in TWS Earbuds
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Mike Danyk
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