xMEMS

BleeqUp Ranger AI Sports Glasses integrate xMEMS Cowell tweeters offering superior audio clarity with 1mm profile for streamlined wearability.

Designed for AI applications, features include real-time translation, contextual feedback, and open-ear awareness for outdoor activities.

Qualcomm Snapdragon W5 chipset powers functionalities like AI Auto Highlights Capture, smart voice control, and cycling data integration.

xMEMS Labs secured $21 million in Series D funding to advance its piezoMEMS technologies for commercial production.

Their innovations include Sycamore microspeaker and μCooling fan-on-a-chip, addressing audio and thermal challenges in AI-enabled devices.

PiezoMEMS technology leverages thin-film piezoelectric materials for improved performance, reliability, and compact form factors.

The SOUNDPEATS Air5 Pro+ features a hybrid driver configuration, combining xMEMS MEMS Cowell drivers and dynamic drivers with PU+PEEK diaphragms.

Advanced AI Adaptive Active Noise Cancelling (ANC) achieves up to 55dB noise reduction, the highest in SOUNDPEATS TWS earphones.

Integrated aptX Adaptive and aptX Lossless codecs, alongside LDAC and LC3 support, ensure high-quality audio streaming compatibility.

The Creative Aurvana Ace 3 earbuds feature xMEMS and 10mm dynamic drivers, providing an extensive frequency range of 5Hz–40kHz for high-resolution sound.

These earbuds support Bluetooth 5.4 with codecs including LDAC, aptX Adaptive, and aptX Lossless, ensuring superior wireless audio quality and compatibility.

Equipped with hybrid adaptive ANC, the earbuds offer enhanced noise-canceling capabilities for an immersive listening experience.

The Creative Aurvana Ace 3 earbuds feature hybrid ANC, aptX Lossless, LDAC, and innovative xMEMS dual-driver technology for high-quality audio.

Equipped with Mimi Sound Personalisation, the earbuds analyze individual ear shapes to create optimized sound profiles tailored to each user.

With Bluetooth 5.4, LE Audio, and Auracast support, these earbuds offer advanced connectivity options for seamless audio experiences.

xMEMS Labs has partnered with Dongguan Rayking Electronics to co-develop the Cypress + Alta-S MEMS speaker module, combining xMEMS’ piezoMEMS technology with Rayking’s acoustic packaging expertise.*

The Cypress MEMS speaker, featuring a solid-state “sound-from-ultrasound” architecture, delivers groundbreaking performance with SPLs exceeding 140dB at 20Hz, enabling superior ANC and sound clarity for TWS earbuds.*

The compact module (10mm x 10mm x 2.8mm) simplifies design, shortens development cycles, and allows OEMs to mass-produce MEMS-based earbuds with improved noise isolation and smaller form factors.*

xMEMS Labs and Dongguan Rayking Electronics have partnered to develop a turnkey Cypress + Alta-S MEMS speaker module for next-generation TWS earbuds, combining xMEMS’ solid-state audio technology with Rayking’s manufacturing expertise.*

The Cypress MEMS speaker, featuring piezoMEMS “sound-from-ultrasound” technology, delivers groundbreaking performance with SPLs exceeding 140dB at 20Hz, enabling superior ANC and sound clarity in compact designs.*

The module simplifies earbud design, reduces time-to-market, and allows OEMs to mass-produce solid-state MEMS-based earbuds, with sampling available now and mass production expected in early 2026.*