
xMEMS Labs has partnered with Dongguan Rayking Electronics to co-develop the Cypress + Alta-S MEMS speaker module, combining xMEMS’ piezoMEMS technology with Rayking’s acoustic packaging expertise.*
The Cypress MEMS speaker, featuring a solid-state “sound-from-ultrasound” architecture, delivers groundbreaking performance with SPLs exceeding 140dB at 20Hz, enabling superior ANC and sound clarity for TWS earbuds.*
The compact module (10mm x 10mm x 2.8mm) simplifies design, shortens development cycles, and allows OEMs to mass-produce MEMS-based earbuds with improved noise isolation and smaller form factors.*

xMEMS Labs and Dongguan Rayking Electronics have partnered to develop a turnkey Cypress + Alta-S MEMS speaker module for next-generation TWS earbuds, combining xMEMS’ solid-state audio technology with Rayking’s manufacturing expertise.*
The Cypress MEMS speaker, featuring piezoMEMS “sound-from-ultrasound” technology, delivers groundbreaking performance with SPLs exceeding 140dB at 20Hz, enabling superior ANC and sound clarity in compact designs.*
The module simplifies earbud design, reduces time-to-market, and allows OEMs to mass-produce solid-state MEMS-based earbuds, with sampling available now and mass production expected in early 2026.*