- xMEMS Labs has partnered with Dongguan Rayking Electronics to co-develop the Cypress + Alta-S MEMS speaker module, combining xMEMS’ piezoMEMS technology with Rayking’s acoustic packaging expertise.
- The Cypress MEMS speaker, featuring a solid-state “sound-from-ultrasound” architecture, delivers groundbreaking performance with SPLs exceeding 140dB at 20Hz, enabling superior ANC and sound clarity for TWS earbuds.
- The compact module (10mm x 10mm x 2.8mm) simplifies design, shortens development cycles, and allows OEMs to mass-produce MEMS-based earbuds with improved noise isolation and smaller form factors.
- Demonstrations of the Cypress + Alta-S module will take place at xMEMS Live Asia 2025, with sampling available immediately and mass production scheduled for early 2026.
- This milestone accelerates the adoption of MEMS audio technology, offering a commercially viable alternative to traditional moving-coil speakers for next-generation wireless earbuds.
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xMEMS Partners with Rayking for Cypress MEMS Speaker Module in TWS Earbuds
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Mike Danyk
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